Friday, February 08, 2008

ST's First 1.75um Pixel Product

Yahoo: ST Micro announces its first 1.75um pixel based product - a 2MP 1/5" VD6725 sensor with integrated ISP. VD6725 fits in phone camera modules smaller than 6 x 6 x 3.8 mm. Its speed is 15fps at full resolution and 30fps at VGA resolution.

The sensor is available in ST's TSV (Through Silicon Via) wafer-level package. This type of package enables the production of reflowable camera modules. These are soldered directly on the phone motherboard, which saves cost, space and time compared with the process of fixing traditional camera modules in the board socket. ST is one of the very few companies that have reflowable camera modules in production.

Engineering samples and demo-kits are available now, with the volume production scheduled for the end of June 2008. Unit pricing is in the $2 range, depending on the production period and quantities. ST's VD6725 single- chip camera sensor is available in two package options, as a COB die or in the TSV wafer-level package.

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